HUANG Hung Chih (D3) , Department of Electrical Engineering and Information Systems, received IEEE ECTC2026 Student Travel Grant Award

On 29th May 2026, HUANG Hung Chih (D3) , Department of Electrical Engineering and Information Systems, received IEEE ECTC2026 Student Travel Grant Award.

Ceremony

Certificate

IEEE ECTC2026 Student Travel Grant Award
This award is presented by the IEEE Electronics Packaging Society (EPS) to support outstanding student researchers from around the world to present their cutting-edge research at ECTC, the premier international conference in the field of microelectronics packaging.

About awarded research

Title:
First Demonstration of microBump-based Massive Orthogonal Stacking Assembly IC (MOSAIC) Cube for SoC-DRAM Direct Stacking

Brief summary:
This study presents the first hardware demonstration of "bump-MOSAIC" technology, designed to overcome the severe thermal bottlenecks of conventional 3D ICs in AI computing. Fabricated with 100 µm pitch micro-bumps, the test vehicle achieves an I/O density potential surpassing HBM4 specifications, with a precise stacking alignment within 6 µm verified by X-ray CT. Furthermore, the optimized configuration (MOSAIC II) delivers a 3-fold improvement in thermal conductivity (89.4 W/m·K) over conventional stacking, while unlocking up to 30% extra memory capacity.

Your impression & future plan
I am deeply honored to have received the Student Travel Grant Award at IEEE ECTC 2026, one of the most prestigious international conferences in the field of semiconductor packaging.
At the conference, I had the valuable opportunity to engage in discussions with leading researchers and industry professionals from around the world on technical advancements and the future development of the industry. The communication and experience were both inspiring and motivating. In particular, as AI technologies continue to spread rapidly, I was reaffirmed in my belief that the development and research of semiconductor packaging technologies—my area of study—will play a crucial role in supporting and advancing future society.
I am committed to continuing my research efforts and contributing further to this field. Finally, I would like to express my sincere gratitude to my academic advisors for their dedicated guidance and to all the members of my laboratory for their constant support and encouragement.