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2020.08.27

【Young Faculty:041】Associate Professor Seiichi Takamatsu : Itou・Takamastu lab, Department of Precision Engineering.



【Biography】
2003.3 B.S., Department of Mechano-informatics, School of Engineering, The University of Tokyo.
2009.5 Ph.D., Department of Mechano-informatics, Graduate School of Information Science and techynology, The University of Tokyo.
2009.6 Postdoctoral Fellow, National Institute of Advanced Industrial Science and Technology (AIST).
2010.4 Researcher, BEANS Laboratory.
2012.4 Researcher, National Institute of Advanced Industrial Science and Technology (AIST).
2014-2015:Visiting researcher (Ecole Nationale Supérieure des Mines de Saint-Etienne, France)
2016.4, Associate Professor, Department of Human and Engineered Environmental Studies, Graduate school of Frontier Sciences, The University of Tokyo.
2020.4, Associate Professor, Department of Precision Engineering, School of Engineering, The University of Tokyo.

【About the Research】
Development of Electronic Textile Interconnection and Packaging Technology

Since my doctoral course, I have been conducting research on electronic textile wiring and packaging technology, which is a combination of MicroElectroMechanical Systems(MEMS), electronic device packaging technology and textile technology. Electronic textile interconnection and packaging technology is an electronic device packaging technology that uses fibers as a substrate for wiring and packaging MEMS sensors, electronic components and semiconductor LSIs on yarns and cloth. By using our technology, we can develop wearable keyboards, health management wear that can measure electrocardiogram and electromyography by simply wearing the device, and smart wear that can provide feedback of stimuli and sounds for enjoying virtual reality and augmented reality.
However, woven fabrics are difficult to fabricate a fine interconnection because they are composed of fibers with many gaps, and they are weak to heat and cannot be used for soldering. To solve these problems, I have developed a new interconnection substrate structure in which fibers are coated with urethane or rubber, and established a new interconnection method by inkjet and screen printing. In addition, we have developed a new low-temperature mounting structure that does not use solder, and a precision assembly machine that enables the assembly of electronic components and thin silicon devices on cloth. We prototyped wearable keyboards and microphone circuits on fabric, as shown in the figure. In addition, we have developed haptic feedback wear for VR system. Our technology has been transferred to industry and is now being used for LED ribbons and LED costumes.



【Future aspirations】
Electronic textile interconnection packaging technology is a newly developed field of engineering. Therefore, the future challenge is the systematic study of necessary technologies such as structure, materials, design methods, mechanical and electrical characteristics modeling, and automatic assembly equipment technologies.

【WEB】
lab:http://impe.t.u-tokyo.ac.jp/index_e.html